Saras Micro Devices, an emerging leader in cutting-edge power performance solutions leveraging integrated packaging design, today announced the grand opening of its new headquarters and state-of-the-art manufacturing facility in Chandler, Arizona. The decision to open a new manufacturing center in Arizona is part of Saras’ longer- term strategy to support its growth in the high-performance computing (HPC) artificial intelligence (AI)/machine learning (ML) sectors and capitalize on the rapidly expanding semiconductor ecosystem in the region. The company is relocating its headquarters from Atlanta, Georgia, where its Research & Development Center will remain.


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“This move is not just a change in geographic location; it is an intentional strategic decision to align our vision with our customers in driving the U.S. semiconductor industry forward,” said Ron Huemoeller, CEO of Saras Micro Devices. “We are grateful for the partnership with the City of Chandler, the Greater Phoenix Economic Council, and the Arizona Commerce Authority, as their support has been instrumental in our successful relocation. This move supports our mission to become an integral part of Arizona’s burgeoning technology ecosystem and our desire to contribute to the strength of the United States’ domestic semiconductor industry. This is where our future becomes a reality, and we’re just getting started.”

The move involves a planned investment of over $50 million in the Chandler facility, which is located at 3200 W. Germann Road. The new facility initially boasts 33,000 sq. ft. of clean room, manufacturing, and administrative space. Saras will employ approximately 50 people in the near term, which will be primarily composed of engineering talent. By close of 2025, both the site and staff will undergo significant expansion, with a projected growth to 43,000 sq. ft., inclusive of a larger 13,000-sq.-ft. clean room.

The proximity of the new headquarters to other key semiconductor ecosystem partners, coupled with Arizona’s cost-effective operations and investment in talent development, uniquely positions Saras to capitalize on these strategic advantages while contributing to a robust domestic semiconductor industry.

“The City of Chandler is thrilled to further expand our semiconductor supply chain industry and bring another technology headquarters to our community with the addition of Saras Micro Devices,” stated Chandler Mayor Kevin Hartke. “We continue to make the short list for these coveted projects due to our central location, top-notch educational system, and pro-business climate. Saras has been a great partner to work with during this process, and we look forward to growing our relationship with them over the years to come.”

“This HQ relocation allows Saras Micro Devices to address present needs of the market while strengthening its ability to develop technology for the future,” said Greater Phoenix Economic Council President & CEO Chris Camacho. “Saras’ innovation in integrated power delivery for semiconductor devices using AI and ML will boost the region’s semiconductor cluster and technological competitiveness.”

“We are excited Saras Micro Devices has selected Arizona for its new headquarters,” said Sandra Watson, president and CEO of the Arizona Commerce Authority. “The Chandler manufacturing facility will enable Saras to continue advancing semiconductor innovation, further showcasing Arizona’s attractiveness as the premier destination for advanced semiconductor operations and contributing to our thriving technology ecosystem. We look forward to supporting their future success in Chandler.”

About Saras Micro Devices

 Established in 2021, Saras Micro Devices is revolutionizing the way power is delivered to advanced semiconductor devices. The company is developing custom and standard integrated passive modules that will significantly improve power performance and efficiency, addressing the challenges faced by the high-performance computing devices serving the growing demand or AI, ML, AR/VR, 5G/6G, and more. Instituted by an impressive team of advanced packaging experts with a combined 150+ years of experience in the microelectronics industry, Saras introduces an innovative embedded, 3D-integrated, vertical power delivery solution that enables higher per-watt performance, minimized routing losses, and greater overall efficiency while reducing the power management impact on the package footprint. Saras Micro Devices has simplified a currently complex solution for managing and optimizing power delivery. Uncover and explore further insights at www.sarasmicro.com.