LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) technology.
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ASU is currently at the forefront of advanced semiconductor packaging research and scale-up, and its newly announced Advanced Packaging Piloting Facility (PPF) created via the CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) will enable researchers and industry leaders to test new materials, devices, and advanced packaging solutions in a state-of-the-art R&D environment. LQDX will provide ASU with its Liquid Metal Ink (LMIx®) chemistries and process IP and will collaborate with sponsored students and industry partners to qualify cutting-edge US-centric semiconductor packaging solutions within the Arizona ecosystem.
“ASU is the new center of gravity of US semiconductor and packaging innovation,” said Simon McElrea, LQDX CEO. “Coupled with the recent CHIPS investments and large-scale manufacturing builds from TSMC and Amkor, there is no better development partner for LQDX. This agreement takes the research partnership we initiated in 2024 to the next level and is focused on the delivery of next generation IC-substrates and advanced semiconductor packaging solutions as enabled by our PVD-in-a-BottleTM technology.”
Professor Hongbin Yu of Arizona State University stated, “We are delighted to work with LQDX on the development and scaling of their advanced packaging technology at ASU. It is our vision to develop and scale cutting-edge semiconductor technologies that further the economic interests of the State of Arizona and the US as a whole, and we welcome LQDX to the AZ ecosystem.”
