Amkor Technology, a leading provider of semiconductor packaging and test services, today announced the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona.
Upon completion of both phases, the campus will offer over 750,000 square feet of cleanroom space and as many as 3,000 high-quality jobs. Construction of the first manufacturing facility on the campus is expected to be completed in mid-2027, with production beginning in early 2028. The new greenfield facilities will serve as a cornerstone of America’s advanced packaging capabilities, supporting key customers including Apple and NVIDIA. Amkor’s expanded investment is supported by the Trump Administration’s CHIPS for America Program, the Advanced Manufacturing Investment Tax Credit, and state and local governments.
“Arizona stands at the forefront of America’s semiconductor industry and Amkor is a vital part of that leadership. Amkor’s new facility represents a transformative investment that will create thousands of good-paying jobs, help build a more resilient supply chain, and solidify Arizona’s semiconductor leadership,” said Governor Katie Hobbs
The expanded investment includes additional cleanroom space and a second greenfield packaging and test facility, increasing total project investment by more than $5 billion, to a total of $7 billion across two phases. The investment from Amkor supports the broader strategy to strengthen U.S. semiconductor leadership and will be the first U.S. based high volume advanced packaging facility.
“This groundbreaking represents a bold step in Amkor’s long-term strategy for growth and innovation,” said Giel Rutten, Amkor’s president and chief executive officer. “We’re building a facility to meet our customers’ most advanced needs that will help shape the future of semiconductor manufacturing in the United States. Arizona offers the right mix of talent, infrastructure, and industry presence, and we’re proud to deepen our roots here.”
Strategically located in Arizona’s growing high-tech corridor, the campus will house the most sophisticated outsourced semiconductor packaging and test facilities in the country. It will feature smart factory technologies and scalable production lines to meet evolving market demands for AI, high performance computing, mobile communications, and automotive applications. The campus will focus on advanced packaging and testing technologies and will complement TSMC’s front-end wafer fabrication for full end-to-end semiconductor manufacturing.
READ MORE: TSMC Arizona: A look inside the $165 billion site
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“Peoria will be the first place in the country where millions of leading-edge microchips are packaged and tested, bringing good-paying jobs and further cementing Arizona as a global leader in the semiconductor supply chain. Today’s groundbreaking is a celebration of what’s possible when we invest in American innovation, and it’s the kind of moment I looked forward to when I was negotiating the CHIPS and Science Act. I’m proud to have worked closely for years with Arizona’s economic development leaders, including Mayor Beck, Governor Hobbs, Sandra Watson, and our teams from the Greater Phoenix Economic Council and Arizona Commerce Authority to make today’s announcement possible.” – U.S. Senator Mark Kelly
“Today’s groundbreaking is a major win for Arizona’s high-tech manufacturing future. This project will bring high-wage jobs, strengthen our economy, and cement our state’s role at the forefront of semiconductor innovation. Smart industrial policy like the CHIPS program is how we bring jobs back to the U.S. from overseas and ensure our supply chains are built here at home. Arizona is becoming the epicenter of America’s semiconductor industry, showing the world that we are open for business, committed to advanced manufacturing, and ready to build the workforce and infrastructure needed to compete on a global scale.” – U.S. Senator Ruben Gallego
“Today marks a significant milestone for Amkor’s legacy in Arizona,” said Sandra Watson, President and CEO of the Arizona Commerce Authority. “Once complete, this cutting-edge advanced packaging facility will serve a critical role as the largest and most advanced outsourced packaging facility in North America.”
“Amkor’s decision to expand in Arizona underscores our state’s role as a global hub for advanced manufacturing and innovation. This project means thousands of new jobs, stronger supply chains, and a clear signal that Arizona is helping drive America’s semiconductor comeback. With investments like this, our state is proving we have the talent, infrastructure, and business climate to compete and win on the world stage,” said Danny Seiden, President & CEO, Arizona Chamber of Commerce & Industry.
“Today’s groundbreaking of Amkor’s advanced packaging and test facility is a landmark moment across our region. This project will bring thousands of quality jobs and a multibillion-dollar investment to Peoria, all while strengthening our country’s critical semiconductor supply chain. Through Peoria’s strong partnership with Amkor we have been able to display all that is possible when private and public industry come together to execute on a shared vision for innovation and growth,” said Mayor Jason Beck, City of Peoria.
